SCREEN releases DW-3100, a new direct imaging system delivering industry-leading precision - New model accelerates the evolution of semiconductor packaging with advanced direct imaging technologies
PlateRite 8600NII-Z/S/E De facto standard 8 page thermal CtP delivering the best balance of productivity and exposure quality These systems feature the latest fiber laser diode exposure heads, enabling them to achieve throughput of up to 32 plates per hour. They can also be fitted with autoloaders to allow the creation of a production line that includes automatic plate supply. This ...
To address this issue, as a leader in semiconductor production equipment, the SCREEN Group has developed an innovative technology for reducing organic wastewater with the potential to dramatically reduce environmental impact.
This page provides materials for SCREEN Holdings’ shareholders and investors. It contains a range of information, including details of shareholders meetings, management policies, share prices and dividends as well as financial statements, annual reports and shareholder communications.
The combination of a high-power laser and GLV™ technology delivers sharp and clear halftone dots, which is the core technology of the PlateRite Ultima 40000N to meet the stringent demands of SCREEN’s clients.
This page provides materials for SCREEN Holdings’ shareholders and investors. It contains a range of information, including details of shareholders meetings, management policies, share prices and dividends as well as financial statements, annual reports and shareholder communications.
SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) has finalized development of the DW-3100, a cutting-edge direct imaging system for advanced semiconductor packages. Sales of the new system will begin this month.
