Abstract: In this study, the thermal characteristics and structure reliability during power cycling for the four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum ...
Abstract: In this article, an innovative layout is introduced to reduce the stray inductance of the multichip power modules (MCPMs) through reverse coupling of current in parallel power loops, which ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback