Abstract: A holistic Die-Package-System level thermal modeling methodology incorporating local details, global features and new material adoption are undoubtedly a key enabler to unleash the ...

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

The measure would not funnel additional money into health savings accounts. House Republicans -- led by Speaker Mike Johnson -- unveiled Friday a narrow health care package to address rising costs, ...

At the start of the academic year, the University implemented sweeping changes to the mail and package delivery system for graduate students. The original graduate package center, located at 160 ...